Polyimide?
The extreme-heat specialist. Survives the solder reflow oven, the autoclave, and the cold of space. Overkill for anything that is not genuinely on fire.
What it is
Polyimide is one of the most heat-resistant printable facestocks: a glass transition above 300 °C, continuous use roughly −269 °C to +260 °C, and brief peaks near 400 °C. It survives lead-free reflow and wave-soldering without shrinking or blistering and tolerates repeated autoclave cycles. High tensile strength and good dielectric properties suit PCB tracking, aerospace parts, and high-temperature lab samples.
Where it fits
— and its limits
It is a true specialty material — higher cost, only needed where extreme heat is genuinely involved. The standard durable build for high-temperature PCB tracking pairs a polyimide face with a silicone adhesive, which carries the heat resistance through to the bond line. For anything short of solder-oven or autoclave conditions, PET or polycarbonate is the more economical choice.
Cross-References
Pairs well
with these entries.
Press Run
See the material in person — not in print.
Sample packs ship 3–5 day air, free for qualified buyers. Touch the material before you commit.